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polishing material

Molecular formula: SiO2,

Component: 60.084,

Density: 2.2g/cm3,

Melting point: 1723 degrees,

Boiling point: 2230 degrees,

Hardness: 4.5,

Thermal conductivity 4 W/(m.K)

Technical indicators

model

P-SiO2-20

P -SiO2-50

P -SiO2-100

Molecular formula

SiO2

SiO2

SiO2

Exterior

White powder

White powder

White powder

The average particle size

20nm

50nm

100nm

Specific surface area

250 m2/g

200 m2/g

150-200 m2/g

SiO2 content

99.9%

99.9%

99.9%

Bulk density

0.15 g/cm3

0.18 g/cm3

0.2 g/cm3

PH value

5-7

5-7

5-7

Surface modification treatment: hydrophilic, lipophilic, hydrophobic (coupling agent KH550 KH560 KH570 A182, etc.)

 
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