Molecular formula: SiO2,
Component: 60.084,
Density: 2.2g/cm3,
Melting point: 1723 degrees,
Boiling point: 2230 degrees,
Hardness: 4.5,
Thermal conductivity 4 W/(m.K)
Technical indicators：
|
model
|
P-SiO2-20
|
P -SiO2-50
|
P -SiO2-100
|
|
Molecular
formula
|
SiO2
|
SiO2
|
SiO2
|
|
Exterior
|
White
lotion
|
White
lotion
|
White
lotion
|
|
The
average particle size
|
20nm
|
50nm
|
100nm
|
|
Solvent
|
Water，ethanol
|
Water，ethanol
|
Water，ethanol
|
|
SiO2
content
|
20%
|
20%
|
20%
|
|
Use
|
Fine polishing
|
Fine polishing
|
Fine polishing
|
|
