Beijing DK nano technology Co.LTD!     CN EN
         
 
 
Lithium battery mate...
Photocatalyst nano-T...
Ceramic materials
polishing material
Antistatic powder
thermal conductive m...
Textile coatings
wear resistant mater...
catalyst carrier
Nano dispersion
nano nonmetallic
Metal Powder
HOME > Application
 
   
 
polishing material

Molecular formula: SiO2,

Component: 60.084,

Density: 2.2g/cm3,

Melting point: 1723 degrees,

Boiling point: 2230 degrees,

Hardness: 4.5,

Thermal conductivity 4 W/(m.K)

Technical indicators

model

P-SiO2-20

P -SiO2-50

P -SiO2-100

Molecular formula

SiO2

SiO2

SiO2

Exterior

White lotion

White lotion

White lotion

The average particle size

20nm

50nm

100nm

Solvent

Waterethanol

Waterethanol

Waterethanol

SiO2 content

20%

20%

20%

Use

Fine polishing

Fine polishing

Fine polishing

 
电话:010-64918089 传真:010-64916735
QQ:2607250814 E-MAIL:beijingdaoking@163.com
COPYRIGHT @ 北京德科岛金科技有限公司 www.dknano.com
京ICP备11020949号 京公网安备 51010702000618号

服务热线

135-5244-5604

微信服务号